- 非IC关键词
企业档案
友情链接
产品信息
硬板制程能力
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英制 |
公制 |
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1 |
拼版尺寸 |
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22" x 26" |
550 x 650mm |
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2 |
孔径 |
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成品孔径 |
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0.004" |
0.10mm |
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成品孔公差 |
沉铜孔 |
±0.003" |
±0.075mm |
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非沉铜孔 |
±0.002" |
±0.050mm |
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压合 |
±0.002" |
±0.050mm |
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纵横比 |
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9 : 1 |
9 : 1 |
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3 |
激光孔 |
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微孔直径 |
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0.004" - 0.010" |
0.10 - 0.15mm |
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纵横比 |
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1 : 1 |
1 : 1 |
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4 |
线宽线距 |
½oz / 18μm |
0.003" / 0.003" |
0.075 / 0.075mm |
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1oz / 35μm |
0.006" / 0.006" |
0.15 / 0.15mm |
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2oz / 70μm |
0.008" / 0.008" |
0.20 / 0.20mm |
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3oz / 105μm |
0.010" / 0.010" |
0.25 / 0.25mm |
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5 |
其他 |
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防焊 |
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±0.003" |
±0.075mm |
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层间距 |
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±0.0024" |
±0.060mm |
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孔铜距(外层) |
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±0.003" |
±0.075mm |
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孔铜距 (内层) |
2L - 8L |
0.010" |
0.25mm |
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10L - 22L |
0.012" |
0.30mm |
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6 |
外形 |
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板边到板边的距离 |
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±0.004" |
±0.100mm |
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孔到板边的距离 |
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±0.004" |
±0.100mm |
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铜线至板边距 |
外层 |
0.010" |
0.25mm |
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内层 |
0.016" |
0.40mm |
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7 |
铜厚 |
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4oz |
140μm |
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8 |
板厚 |
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0.189" |
4.80 mm |
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9 |
板厚 |
双面 |
0.008" |
0.20mm |
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4层 |
0.016" |
0.40mm |
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6 -22层 |
0.020" |
0.60mm |
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10 |
孔铜厚度 |
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0.004" |
0.10mm |
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11 |
防焊厚度 |
0.004" |
0.10mm |
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12 |
阻抗控制 (欧姆) |
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±10% |
±10% |
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13 |
层数 |
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1~22层 |
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14 |
板材 |
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FR-4，CEM-3，铝基板材，Rogers板材，高TG基材 |
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15 |
表面处理 |
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喷锡、无铅喷锡、沉金、沉银、OSP、金手指、选择性沉金，电镀金 |
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